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US Patent Issued to LG INNOTEK on Aug. 11 for "Circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,559, issued on Aug. 11, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board" was invented by Myung Jae Kwon (Seoul, So... और पढ़ें


US Patent Issued to IBIDEN on Aug. 11 for "Wiring substrate and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,560, issued on Aug. 11, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate and method for manufacturing the same" was invent... और पढ़ें


US Patent Issued to MITSUBISHI ELECTRIC on Aug. 11 for "Magnetic ceramic substrate, substrate manufacturing method, and circulator" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,561, issued on Aug. 11, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Magnetic ceramic substrate, substrate manufacturing method, and... और पढ़ें


US Patent Issued to Ennostar on Aug. 11 for "Micro light-emitting package" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,562, issued on Aug. 11, was assigned to Ennostar Corp. (Hsinchu City, Taiwan). "Micro light-emitting package" was invented by Hsin-Lun Su (... और पढ़ें


US Patent Issued to LG INNOTEK on Aug. 11 for "Circuit board" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,563, issued on Aug. 11, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board" was invented by Sang Myung Lee (Seoul, So... और पढ़ें


US Patent Issued to CHIPBOND TECHNOLOGY on Aug. 11 for "Flexible circuit board" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,564, issued on Aug. 11, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan). "Flexible circuit board" was invented by Ting-Yi Kuo (... और पढ़ें


US Patent Issued to UNIVERSIDADE DE COIMBRA on Aug. 11 for "Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof" (Portuguese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,565, issued on Aug. 11, was assigned to UNIVERSIDADE DE COIMBRA (Coimbra, Portugal). "Flexible printed circuit, ink and method for obtainin... और पढ़ें


US Patent Issued to Intel on Aug. 11 for "Stackable memory module with double-sided compression contact pads" (Oregon Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,566, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Stackable memory module with double-sided compression contact p... और पढ़ें


US Patent Issued to Tacto Tek on Aug. 11 for "Electronic structure and a method of manufacturing such" (Finnish Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,567, issued on Aug. 11, was assigned to Tacto Tek Oy (Oulunsalo, Finland). "Electronic structure and a method of manufacturing such" was in... और पढ़ें


US Patent Issued to MEDIMAGING INTEGRATED SOLUTION on Aug. 11 for "Light-emitting image sensing module and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,568, issued on Aug. 11, was assigned to MEDIMAGING INTEGRATED SOLUTION INC. (Hsinchu, Taiwan). "Light-emitting image sensing module and met... और पढ़ें